Hanoi (VNA) – Electronics giant Samsung of theRepublic of Korea’s recent board meeting has approved the spending of some 850million USD for its unit in Vietnam to manufacture flip-chip ball grid arrays (FC-BGA),according to KBS News.
FC-BGA is ahighly-integrated package board used to connect a high-integrationsemiconductor chip to a main board.
The company will spend the investment in phases until 2023 tobuild the new FC-BGA production line.
According to the plan, the Vietnamese subsidiary willfocus on producing FC-BGA while Samsung's factories in Suwon City (Gyeonggi)and Busan City will specialise in technology development and high-endproducts./.